3D-PLUS Components Distributor
About 3d-plus
: 3D Plus is a world leading supplier of advanced high density 3D microelectronic products and bare die and wafer level stacking technology meeting the demand for high reliability, high performance and very small size of today's and tomorrow's electronics.Comparing to other existing 2D traditional solutions, 3D Plus's technology allows gaining a factor of at least 10 on the weight and volume of the components.
3D Plus standard products and System-In-Package (SiP) solutions are used in high technology industries for industrial, computer boards & embedded systems, defense & security, aircrafts & avionics, medical & sciences and aerospace applications.3D Plus produces a range of high density packaging products with interconnection in three dimensions (3D) to drastically reduce applications� mass and volume, and to enhance their electrical performances and harsh environment tolerance.
Standard products include:
Memory modules based on SDRAM, DDR SDRAM, SRAM, FLASH and EEPROM
DSP-based computer cores
Camera heads and video chain electronics (PAL and NTSC standards)
Low power DC/DC converters for distributed power architectures
Radiation tolerant and radiation hardened modules
3D Plus also produces made-to-order products defined by the specific needs of individual customers. With its System-In-Package solutions, 3D PLUS embeds in one single and miniaturized package active, passive, opto-electronics and MEMS/MOEMS components for today�s and tomorrow�s electronic designs.
The great miniaturization possibilities combined with the flexibility and the short lead time of 3D PLUS solutions are recognized and selected by today�s most demanding customers.
MEMORY MODULES
Focussing on smaller, faster, larger capacity and wide bit organization, 3D PLUS leads the way in a number of value-added memory modules matching the needs of today�s and tomorrow�s electronics.
The 3D technology enables savings of at least factor 10 on weight and volume of the components compared to existing SMD solutions.
Furthermore, reliability and electronic performances are significantly improved since parasitic effects (e.g. resistance, inductance and capacity) are reduced in the same proportions as the reduction in volume.
Benefits include:
Miniaturization (save up to 80% space and weight in the design)
Very high density
Wide bit organization
High operating speed and high signal integrity and immunity to noise and ground bounce
Very high reliability
Radiation guaranty for Space application (TID, SEL and SEU)
Robust to harsh environment for avionics and military applications
EMBEDDED PROCESSOR MODULES
Embedding a processor core, an FPGA companion chip, and some RAM and ROM memory types as well as some I/O interface components in one single package, our computer module provide our customers with one of the most integrated, fully tested and ready to use computer core solution.
CCD CAMERA MODULE
Our miniaturized, lightweight and easy-to-use colour CCD camera head are suitable for embedded systems and industrial and medical endoscopes applications with � of 4.8mm and 2.8mm. It embeds state-of-the art CCD sensors with high resolution and sensitivity, low smear and dark current, and excellent anti-blooming characteristics.
The embedded electronics provide the camera with a long cable-driving capability: up to 10m of cable can be connected between the camera head and the base station.
3D-Plus Distributor
IBS Electronics is an electronic component distributor of interconnect, power and electromechanical products, capacitors, transistors, resistors, diodes, fuses, integrated circuits ICs, plus a diversity electronic, electrical, and electromechanical components and assemblies.3D-Plus Components - Inventory
3DFN16G08VS1712-IB | 3DFN16G08VS1712 IB 3D Plus NAND Flash Memory 16Gb (2G x 8) 3.3V Industrial Grade -40C to +85C SOP50 RoHS | 3D-PLUS | 271 |
3DFN32G08US2845-IB | 3DFN32G08uS2845 IB 3D Plus NAND Flash 32Gbit NONSYN/SYN 3.3V 54-SOP RoHS | 3D-PLUS | 148 |
3DFS128M01VS2728 | 3DFS128M01VS2728 3D Plus Radiation Tolerant SPI NOR Flash 128 Mb TMR Up to 40 MHz clock SOP 20 TMR module with SEU immunity | 3D-Plus | rfq |
3DFS256M04VS1740 | 3DFS256M04VS1740 3D Plus Radiation Tolerant SPI NOR Flash 256 Mb Up to 133 MHz clock SOP 18 Up to 133 MHz clock | 3D-Plus | rfq |
3DFS256M04VS1740-CN | 3DFS256M04VS1740 CN 3D Plus Quad SPI Flash NOR Memory 256Mbit 3V 18-SOP Commercial RoHS | 3D-PLUS | 310 |
3DFS256M04VS1740-IB | 3DFS256M04VS1740 IB 3D Plus Quad SPI Flash NOR Memory 256Mbit 3V 18-SOP Industrial RoHS | 3D-PLUS | 46 |
3DFS256M04VS2801 | 3DFS256M04VS2801 3D Plus Radiation Tolerant SPI NOR Flash 256 Mb TMR Up to 50 MHz clock SOP 24 TMR module with SEU immunity | 3D-Plus | rfq |
3DFS512M04VS2722 | 3DFS512M04VS2722 3D Plus Radiation Tolerant SPI NOR Flash 512 Mb Up to 133 MHz clock SOP 18 | 3D-Plus | rfq |
3DFS512M04VS2722-IB | 3DFS512M04VS2722 IB 3D Plus Flash Memory 512Mb QSPI NOR Flash 3.0V Industrial Grade -40C to +85C SOP-18 RoHS | 3D-PLUS | 481 |
3DLT163245US1696-IB | 3DLT163245uS1696 IB 3D Plus IC Transceiver 32-bit Bidirectional Level Shifter 1.8V to 3.3V Industrial Grade -40C to +85C SOP82 RoHS | 3D-PLUS | 236 |