CN-1703 Details / Availability
CN-1703 Summary: CN-1703 from Zymet is Zymet CN-1703 is designed for CSP and BGA encapsulation. CSP�s and BGA�s are not normally encapsulated. However it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations.
Details
Part Number: CN-1703
Description : Zymet CN-1703 is designed for CSP and BGA encapsulation. CSP�s and BGA�s are not normally encapsulated. However it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations.
Manufacturer: Zymet
Category: Chemicals
Datasheet: Click here for Datasheet I
Quantity Avail: rfq
Price: Request for Quote
Zymet
- Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly. Its adhesives include electrically conductive adhesives, thermally conductive adhesives, anisotropically conductive adhesives, ultra-low stress adhesives, and optoelectronics adhesives. Its encapsulants include UV curable glob top encapsulants, dam-and-fill encapsulants, and underfill encapsulants. Its underfill encapsulants include flip chip encapsulants and reworkable CSP and BGA encapsulants.Related Components for CN-1703
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CN-1703 Zymet zymet cn-1703 is designed for csp and bga encapsulation. csp�s and bga�s are not normally encapsulated. however it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations.