Home > Mechanical Components > IERC

IERC CTS Corporation

IERC manufactures Heat sinks, thermal management devices, ZIF retainers, SEM cages, board retainers. CTS acquisition of Dynamics Corporation of America in 1997 marked the integration of the former International Electronic Research Corporation (IERC) into CTS. CTS Thermal Management, a division of CTS Corporation (NYSE: CTS), specializes in manufacturing a range of products including heat sinks, thermal management devices, ZIF retainers, SEM cages, and board retainers.

Since then, CTS has dedicated itself to the development, manufacturing, and marketing of high-quality standard and custom thermal management products, as well as rugged circuit board retainers. These products cater to the electronics and military industries, ensuring optimal performance, reliability, and longevity of electronic devices.

Thermal management is a critical aspect of electronic design, involving solutions to effectively control component temperatures. CTS's product line includes heat sinks, thermal interface materials (TIM), fans, liquid cooling systems, and various other technologies.

CTS Electronic Components stands out as a leading designer and manufacturer of electronic components, providing electronics manufacturing services to OEMs in the automotive, computer, and telecommunications markets. The company's business systems are finely tuned to accommodate each customer's unique design and lead-time requirements.

CTS adds value to its customer relationships through technical assistance during the design stage, rapid prototype turnaround, and dedicated manufacturing throughout the application life cycle. CTS Thermal Management products are available and supported through the global network of manufacturer representatives, distributors, and R&D facilities associated with CTS. CTS provides customers with a range of Thermal Management Products including various forged and extruded Heatsinks, Fan-sinks, Board Retainers, and traditional stamped heatsinks. Common use parts are carried in stock by a number of CTS Distributors and our fast, efficient, Global Logistics Team supports customers around the world. We make Thermal Solutions fast, easy and cost effective for customers in many markets, including commercial and industrial electronics and Military/Aerospace applications. Examples include predesigned solutions for Xilinx and Altera FPGAs. The customer engineer decides on an FPGA product, configuration, and system requirements and simply picks a CTS Heatsink from the Design Guide listing. CTS Applications Engineers are available for fast, expert support if needed.

CTS Electronic Components is a division of CTS Corporation. The division has five product lines: Electrocomponents, Filters, Frequency Control, Resistors, and Thermal Management Solutions. The company manufactures an extensive array of frequency-control devices, ceramic RF filters and duplexers, EMI/RFI filters, capacitors, DIP and rotary switches, rotary and linear potentiometers, encoders, resistor and resistor/capacitor networks, and heat management components. With manufacturing locations in Albuquerque, New Mexico; Hopkinton, Massachusetts; Nogales, Mexico; Singapore; Zhongshan and Tianjin, China; and Kaohsiung, Taiwan; CTS is able to serve major markets such as medical, defense and aerospace, industrial controls, power management, HVAC, security, lighting, audio, communications, computer, and electronic networking.

Applications:

Heatsinks

CTS has designed and engineered a wide range of efficient heatsinks for electronic device, circuit, and system thermal management applications. These heatsinks are available in a variety of formats, including extruded, precision forged, and stamped units. Heatsinks can be supplied in standard horizontal or vertical mounting to circuit boards or other heat sources with a choice of round pin fins or elliptical fins for effective heat dispersion, and in compact clip mounted BGA formats to “beat the heat” while maintaining small design dimensions. Heatsinks can also be supplied as RoHS-compliant units in a variety of sizes and configurations.

Fan Heat Sinks
High Temp Fan Heatsinks

Adhesive Peel and Stick Heat Sinks
Adhesive Peel and Stick Heat Sinks – Part Number Series: BDN

Extruded Heatsinks for Power Transistors
Extruded Heatsinks for Power Transistors

Forged Heatsinks with Plate Fins
Forged Heatsinks APF AER Series

Pin Fin Configuration
Pin Fin Configuration – Part Number Series: APR

Clip Styles for Forged Heatsinks
Clip Styles for Forged Heatsinks

Thermal Links for TO-5, TO-8 and TO-18 Transistors
Thermal Links for TO-5, TO-8 and TO-18 Transistors

Stamped Heatsinks for Power Transistors
Stamped Heatsinks for Power Transistors

For more information and to explore their product offerings, please visit www.ctscorp.com and navigate to Components - Heat Sinks/Thermal Management Solutions and Circuit Board Retainers and Card Cages.