CN-1453 Details / Availability
CN-1453 Summary: CN-1453 from Zymet is Zymet CN-1453 is a new reworkable BGA underfill encapsulant. It is a silica filled version.
Details
Part Number: CN-1453
Description : Zymet CN-1453 is a new reworkable BGA underfill encapsulant. It is a silica filled version.
Manufacturer: Zymet
Category: Chemicals
Datasheet: Click here for Datasheet I
Quantity Avail: rfq
Price: Request for Quote
- Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly. Its adhesives include electrically conductive adhesives, thermally conductive adhesives, anisotropically conductive adhesives, ultra-low stress adhesives, and optoelectronics adhesives. Its encapsulants include UV curable glob top encapsulants, dam-and-fill encapsulants, and underfill encapsulants. Its underfill encapsulants include flip chip encapsulants and reworkable CSP and BGA encapsulants.
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CN-1453 Zymet zymet cn-1453 is a new reworkable bga underfill encapsulant. it is a silica filled version.
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IBS Electronics distributes genuine Zymet CN-1453 zymet cn-1453 is a new reworkable bga underfill encapsulant. it is a silica filled version.. We currently maintain an inventory with a wide array of components. These include ICs, Discrete Components, Capacitors, Resistors, Connectors, Relays, Crystals, Ocillators, Inductors; as well as Mil-Spec, Industrial Grade, Commercial Grade, Hard-to-Find and Obsolete components. We also have the ability and industry connections to source globally.
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