CN-1728 Details / Availability
CN-1728 Summary: CN-1728 from Zymet is Zymet CN-1728 reworkable underfill encapsulant designed to underfill Package-on-Package (POP)
Details
Part Number: CN-1728
Description : Zymet CN-1728 reworkable underfill encapsulant designed to underfill Package-on-Package (POP)
Manufacturer: Zymet
Category: Chemicals
Datasheet: Click here for Datasheet I
Quantity Avail: rfq
Price: Request for Quote
Zymet
- Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly. Its adhesives include electrically conductive adhesives, thermally conductive adhesives, anisotropically conductive adhesives, ultra-low stress adhesives, and optoelectronics adhesives. Its encapsulants include UV curable glob top encapsulants, dam-and-fill encapsulants, and underfill encapsulants. Its underfill encapsulants include flip chip encapsulants and reworkable CSP and BGA encapsulants.Related Components for CN-1728
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