UA-2605-B-10CC Details / Availability
UA-2605-B-10CC Summary: UA-2605-B-10CC from Zymet is UA-2605-B 10ml Zymet Edgebond Adhesive Syringe Reworkable for BGA CSP and other surface mount components.
Details
Part Number: UA-2605-B-10CC
Description : UA-2605-B 10ml Zymet Edgebond Adhesive Syringe Reworkable for BGA CSP and other surface mount components.
Manufacturer: Zymet
Quantity Avail: rfq
Price: Request for Quote
Zymet
- Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly. Its adhesives include electrically conductive adhesives, thermally conductive adhesives, anisotropically conductive adhesives, ultra-low stress adhesives, and optoelectronics adhesives. Its encapsulants include UV curable glob top encapsulants, dam-and-fill encapsulants, and underfill encapsulants. Its underfill encapsulants include flip chip encapsulants and reworkable CSP and BGA encapsulants.Related Components for UA-2605-B-10CC
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UA-2605-B-10CC Zymet ua-2605-b 10ml zymet edgebond adhesive syringe reworkable for bga csp and other surface mount components.
UA-2605-B-10CC Zymet ua-2605-b 10ml zymet edgebond adhesive syringe reworkable for bga csp and other surface mount components.